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MATERIAL PROFILE

SCM5H00 | HTC PEEK

A thermally conductive yet electrically insulating compression-molded PEEK grade for precision components requiring thermal management.

Product Overview

A thermally conductive yet electrically insulating compression-molded PEEK grade for precision components requiring thermal management.

Key Features

  • High thermal conductivity (≥5 W/m·K)
  • Insulation (surface resistance ≥10¹³ Ω)
  • Heat resistance
  • Compression-molded stock

Applications

  • Thermal-management insulation parts
  • Electronic equipment structures
  • Precision machined components

Material and Processing Consultation

Please contact us to discuss grade selection, supply form, sizes and material processing needs. Exact properties vary by grade and test conditions.

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